Rigidum PCB Circuit Board
| Ordo Qty. | Massa productio | Sample production | |
| Layer comitem | 2~ 32L | 48L | |
| Maximilianus.PCB Crassitudo | 12mm (472mil） | 12mm (472mil) | |
| Min.Latitudo/Space | Interiorem tabulatum | 2.5mil/2.5mil | 2.2mil/ 2.2mil |
| Tegumen | 3mil/3mil | 2.8mil/ 2.8mil | |
| Maximilianus.Aeris Crassitudo | 6Oz | 30Oz | |
| Min.Drill foraminis diam | Mechanica foramen | 0.15mm (6mil) | 0.1mm (4mil) |
| Laser foramen | 0.1mm (4mil) | 0.093mm (3mil) | |
| Maximilianus.Magnitudine (Finish Size) | Una & duplex postesque stratis | 1150mmX500mm | 1250mmX550mm |
| Multilayer | / | 1250mmX570mm | |
| Aspect ratio (Finish Hole) | 10:01:00 | 16:01:00 | |
| Materia | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| Princeps Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| alii | Alu.-fundatur, cu-dicetur etc. | ||
| Superficiem Conclusio | HASL, ENIG, immersio plumbi, OSP, immersio Argentea;Electroplating Aurum durum, molle aurum, Aurum digitum, Selectivum OSP, ENEPIG. | ||
| HeavyCopperPCB | Maximilianus.Aeris Crassitudo | 6Oz | 30Oz |
| HDI PCB* | Structure | Any Layer (10L) | Any Layer (10L) |
| Latitudo / Space (exterioris) | 2.5mil/2.5mil | 2mil/2mil | |
| Aspect ratio (caecum foramen) | 1:01:00 AM | 1:01:00 | |